Intel begins EUV lithography of ‘Intel 4’ process in Ireland
Intel has started the mass production of chips using the ‘Intel 4’ process at an opening event for Fab 34 in Leixlip, Ireland.
This will be the first time extreme ultraviolet lithography has been used for the commercial production of chips in Europe and is part of Intel’s drive to advance five process nodes in four years. This is in turn part of Intel CEO Pat Gelsinger’s pledge to catch up in chip technology with leaders TSMC and Samsung.
The opening will allow production of such products as Intel’s upcoming Intel Core Ultra processors (code-named Meteor Lake), which will pave the way for AI PCs, as well as future-generation Intel Xeon processors coming in 2024 and produced on the Intel 3 process node.
While Intel is ramping its nominal 4nm process technology now TSMC and Samsung are already at 3nm. Intel claims its ‘Intel 3’ process is due to be “manufacturing ready” in 2H23. Given that wafers can spend up many months in process for this advanced nodes that could effectively mean mass production in 1H24.
Intel’s roadmap states that it aims to achieve “process leadership” at about the 2nm node in 2025.
Ann Kelleher, general manager of technology development at Intel, and Keyvan Esfarjani, chief global operations officer, accompanied Gelsinger at the opening ceremony.
“The Silicon Isle has always been core to our long-term strategy, and today’s opening of Fab 34 contributes to the EU’s goal of creating a more resilient and sustainable semiconductor supply chain,” said Gelsinger.
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