Socionext and imec renew agreement for advanced semiconductor research
Cette publication existe aussi en Français
Socionext has renewed its cooperative research agreement with imec, expanding its focus on advanced 3D packaging and chiplet technologies. The agreement, part of imec’s Core Partner Program, positions Socionext to push further into high-reliability semiconductor design for next-generation applications, particularly in automotive.
For eeNews Europe readers, this development highlights the growing importance of heterogeneous integration, chiplets, and design-technology co-optimization in reducing costs and scaling performance in high-demand markets.
Expanding into chiplets and 3D packaging
Socionext has been working with imec since 2015 on design-technology and system-technology co-optimization. With this renewed agreement, the company will broaden its research into 3D advanced packaging technologies and chiplet reliability, targeting applications where quality and precision are critical.
Chiplets and heterogeneous integration are emerging as key enablers of flexible architectures and application-specific scaling. For automotive in particular, thermal and mechanical strength issues must be addressed alongside cost and design efficiency. Socionext says the extended collaboration with imec will allow it to gain deeper insights into these challenges, supporting the development of high-reliability chiplets and SoCs.
“Since its establishment in 2015, Socionext has continuously participated in the imec Core Partner Program and accumulated a wealth of knowledge,” said Hisato Yoshida, President and COO of Socionext. “By further promoting the collaboration with imec announced today, we aim to contribute to global innovation while also focusing on nurturing engineers equipped with the world’s most advanced technological capabilities.”
Driving innovation in automotive and beyond
Socionext positions its business under the “Solution SoC” model, which focuses on early-stage design engagement and end-to-end services, from production to quality control. The company emphasizes that open ecosystem partnerships, like those with imec, are essential to accelerate development and maintain competitiveness.
Imec echoed this vision: “We are very pleased to extend our partnership with Socionext in our Core Partner Program,” said Luc Van den hove, President and CEO of imec. “It is a confirmation that imec brings application focused value related to design, development and manufacturing for fabless and system companies. Socionext is an important partner that shares this vision. Imec will continue to work closely with Socionext to drive innovation across the semiconductor value chain.”
For the semiconductor sector, where Angstrom-node process technologies, backside wiring, and high-density mounting are becoming critical, collaborations like this provide both companies with a stronger foundation to tackle technical and economic hurdles. For automotive chiplets in particular, ensuring reliability while maintaining efficiency could be a game-changer.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
